Author:               Thomas Musil
Project:                D.I. Winfried Ritsch
Developed at:      Institute of Electronic Music (IEM),
                            University of Music and dramatic Arts in Graz, Austria

The MAAS-DSP-Board and the I/O-Modules are part of the MAAS-Project.
The MAAS-hardware is divided into 3 groups:

The heart of MAAS-Hardware is the MAAS-DSP-Board. It could be inserted into a PCI-Slot of a Host-Computer or operate as stand-alone  card. Each Module-Interface separates the particular data-slot of each data-frame from the ESSI-Trasmit-Data-stream and passes it on to the appropriate Output-Module; the data coming from each Input-Module is merged into the ESSI-Receive-Data-stream in the particular data-slot by the appropriate Module-Interface. Several hardware mounting-options of MAAB are possible (see Mounting-Options).
Several I/O-configurations of the ESSI are possible.
 
MAAB-Scheme

The schematic circuit diagram of MAAB is shown in 12 files: 6 post-script-files for printing and 6 GIF-files for displaying.
 

    schematic_1.ps (721 kb)     schematic_1.gif (27 kb)
    schematic_2.ps (409 kb)     schematic_2.gif (20 kb)
    schematic_3.ps (399 kb)     schematic_3.gif (22 kb)
    schematic_4.ps (427 kb)     schematic_4.gif (27 kb)
    schematic_5.ps (174 kb)     schematic_5.gif (14 kb)
    schematic_6.ps (264 kb)     schematic_6.gif (14 kb)
(back to Table of Contents)
 The different layers of the printed circuit board layout are shown in 18 files: 9 post-script-files for printing and 9 GIF-files for displaying.
 
    top_placing.ps (260 kb)     top_placing.gif (11 kb)
    top_solder_stop.ps (59 kb)     top_solder_stop.gif (8 kb)
    top_copper.ps (173 kb)     top_copper.gif (16 kb)
    ground_layer_2.ps (61 kb)     ground_layer_2.gif (8 kb)
    supply_layer_3.ps (55 kb)     supply_layer_3.gif (9 kb)
    bottom_copper.ps (143 kb)     bottom_copper.gif (12 kb)
    bottom_solder_stop.ps (49 kb)     bottom_solder_stop.gif (7 kb)
    bottom_placing.ps (134 kb)     bottom_placing.gif (4 kb)
    drill.ps (199 kb)     drill.gif (12 kb)
(back to Table of Contents)
 
 
Reference-Designator: # Value / Part-Description: Package / Lead- 
Dimension:
C1 1 390 pF, 50 V, SMD Ceramic-Multilayer Capacitor Chip-Size 1206
C2,C10.....C58,C62,C66, C68,C70,C72,C74 56 100 nF, 50 V, SMD Ceramic-Multilayer Capacitor Chip-Size 1206
C3,C4 2 22 pF, 50 V, SMD Ceramic-Multilayer Capacitor Chip-Size 1206
C6,C59,C63,C67,C69, C71,C73,C75......C8 14 47 µF, 16 V, Leaded Radial Aluminum-Electrolytic Capacitor LS = 5mm
C7,C8 2 1.0 µF , 35 V, Leaded Radial Tantalum-Electrolytic Capacitor LS = 5mm
C9 1 470 µF, 10 V, Leaded Axial Aluminum-Electrolytic Capacitor LS < 20mm, 
Diameter < 10mm
C60,C61,C64,C65, C82,C83 6 10 µF , 16 V, Leaded Radial Tantalum-Electrolytic Capacitor LS = 5mm
C84.......C89 6 10 µF , 10 V, SMD-Chip Tantalum-Electrolytic-Capacitor Chip-Size (l×w×h) = 
6×3.2×2.5 mm
F1,F4 2 RUE110, PTC-Multi-Fuse, 
1.1A / 2.2 A, Leaded		 LS = 5mm
F2,F3,F5,F6 4 RXE020, PTC-Multi-Fuse, 
0.2A / 0.4 A, Leaded		 LS = 5mm
IC1 1 DSP56301PW80, 
Motorola 3.3V-DSP		 SMD TQFP208 
(pdf-datasheet)
IC2 1 AT29LV512-20JC, Atmel 3.3V- 
Flash-PROM, 64k × 8, 200 ns		 SMD PLCC32 
(pdf-datasheet)
IC3.....IC5 3 UM61L256A-10, UMC 3.3V- 
Fast-Static-RAM, 32k × 8, 10 ns		 UM61L256A-10, UMC 3.3V-Fast-Static-RAM, 
32k × 8, 10 ns 
(pdf-datasheet)
IC6......IC8 3 74HCT377, Octal-D-FF + Enable, 
Leaded		 DIL 20 (pdf-datasheet)
IC9,IC11,IC12,IC14 4 74HCT125, Quad-Line-Driver, 
Leaded		 DIL 14 (pdf-datasheet)
IC10,IC13 2 74HCT126, Quad-Line-Driver, 
Leaded		 DIL 14 (pdf-datasheet)
IC15 1 74HCT241, Octal-Bus-Driver SMD SO20 
(pdf-datasheet)
IC16 1 Quartz-Oscillator, Leaded,16 MHz Metal-Case, DIL8 
(pdf-datasheet)
IC17 1 PC900V, Optocoupler, Leaded DIL 6 (pdf-datasheet)
IC18 1 74LS07, Hex-Buffer, Leaded DIL14 (pdf-datasheet)
IC19 1 MAX 811 LCUS-T, 5V-Under-Voltage-Sensor and Reset-Controller SMD SOT-143 
(pdf-datasheet MAX811) 
(pdf-datasheet MC34164)
IC20 1 LT1085 CT-3.3, Linear-Techn. 3V3-Lowdrop-Voltage-Regulator, Leaded TO 220 
(pdf-datasheet)
IC17" 1 IC-Socket, Leaded DIL6
IC9".......IC14",IC18" 7 IC-Socket, Leaded DIL14
IC6"......IC8" 3 IC-Socket, Leaded DIL20
JP1,JP2, CON2.....CON6,CON8 2 Dual-Pin-Array, 2×50 , Leaded, Vertical LS = 2.54 mm
CON2 1 SCSI-2-Socket, 50 poles, 90-Degree, Leaded
CON7 1 D-SUB-9-Socket, 9 poles , 90-Degree, Leaded, Female
SW1 1 Micro-Push-Button , 90-Degree, Leaded
R1 1 680 k, Leaded Resistor
R2.....R7,R9 7 10 k, SMD-Chip-Resistor Chip-Size 1206
R8 1 1k, Leaded Resistor
R10.....R14 5 220 E, Leaded Resistor
R17 1 150 E, Leaded Resistor
RN1,RN3,RN5.....RN7 5 8×10k L09-1, Leaded Resistor-Array SIL9
RN2,RN4 2 8×1k L09-1, Leaded Resistor-Array SIL9
Q1 1 Quartz , 17 MHz , Leaded, Vertical  Metal-Case, HC 18/U
D1 1 1N4148, Diode, 100 mA, 100 V , Leaded
D3 1 1N5819, Schottky-Diode , Leaded
LED1 1 Green LED, Leaded Diameter = 3mm
(back to Table of Contents)
For producing a PCB, you need 6 gerber-files and their aperture-files plus 1 excellon-drill-file and its drill-configuration-file. There are 2 solder-stop-files, 1 top-layer-file, 1 bottom-layer-file and 2 inner-layer-files in gerber-format. There is also one drill-file in excellon-format. All files are seen from top-view and not mirrored. The 2 solder-stop-files and the 2 inner-layer-files are displayed inversely. The order of the following gerber-files is the same as the arrangement of the layers in the PCB.
 
top_solder_stop.gerber (50 kb) top_solder_stop.aperture (2 kb)
top_copper.gerber (118 kb) top_copper.aperture (2 kb)
ground_layer.gerber (24 kb) ground_layer.aperture (2 kb)
supply_layer.gerber (26 kb) supply_layer.aperture (2 kb)
bottom_copper.gerber (100 kb) bottom_copper.aperture (2 kb)
bottom_solder_stop.gerber (43 kb) bottom_solder_stop.aperture (2 kb)
drill.excellon (12 kb) drill.configuration (1 kb)
(back to Table of Contents)
The board contains 5 Jumpers: (back to Table of Contents)
The DSP56301 has 4 internal chipselect-pins: AA0 selects 32768 × 24 Bit Read & Write;
AA1 selects 65536 × 8 Bit (Data-Bit 0 to 7) Read & Write;
AA2 selects 1 × 24 Bit Write-Only;

(back to Table of Contents)

The 8 Direction-Bits are defined: (back to Table of Contents)
 
 
Pin: Signal-Name: Signal-Description:
1 S1-12V - 12 V Supply (200 mA Fuse)
2 S1-12V - 12 V Supply (200 mA Fuse)
3 S1+12V + 12 V Supply (200 mA Fuse)
4 S1+12V + 12 V Supply (200 mA Fuse)
5 GND Ground
6 GND Ground
7 S1+5V + 5 V Supply (1 A Fuse)
8 S1+5V + 5 V Supply (1 A Fuse)
9 NC  not connected
10 NC not connected
11 S1+5V + 5 V Supply (1 A Fuse)
12 S1+5V + 5 V Supply (1 A Fuse)
13 GND Ground
14 RESERVED Reseved for future-purpose
15 GND Ground
16 RESERVED Reseved for future-purpose
17 GND Ground
18 S1TFS Transmit-Frame-Sync (IO)
19 GND Ground
20 S1RFS Receive-Frame-Sync (IO)
21 GND Ground
22 S1TCK Transmit-Clock (IO)
23 GND Ground
24 S1RCK Receive-Clock (IO)
25 GND Ground
26 S1TDX Transmit-Data (OUT)
27 GND Ground
28 S1RDX Receive-Data (IN)
29 GND Ground
30 S1CRDX Configuration-Receive-Data (IN)
31 GND Ground
32 S1RFSDIR Receive-Frame-Sync-Direction (OUT)
33 S1RST ESSI-Reset
34 S1TFSDIR Transmit-Frame-Sync-Direction (OUT)
35 S1RCKDIR Receive-Clock-Direction (OUT)
36 S1TCKDIR Transmit-Clock-Direction (OUT)
37 S1DT/CTL Data/Control-Qualifier (OUT)
38 S1SRB1 Sample-Rate-Bit 1 (OUT)
39 S1SRB0 Sample-Rate-Bit 0 (OUT)
40 S1SRB2 Sample-Rate-Bit 2 (OUT)
41 GND Ground
42 S1CTDX Configuration-Transmit-Data (OUT)
43 GND Ground
44 S1CTEN Configuration-Transmit-Enable (OUT)
45 GND Ground
46 S1CCLK Configuration-Clock (OUT)
47 GND Ground
48 S1CREN Configuration-Receive-Enable (OUT)
49 GND Ground
50 KEY not connected and mechan. Key
 
(back to Table of Contents)
 
Pin: Signal-Name: Signal-Description:
1 S2-12V - 12 V Supply (200 mA Fuse)
2 S2-12V - 12 V Supply (200 mA Fuse)
3 S2+12V + 12 V Supply (200 mA Fuse)
4 S2+12V + 12 V Supply (200 mA Fuse)
5 GND Ground
6 GND Ground
7 S2+5V + 5 V Supply (1 A Fuse)
8 S2+5V + 5 V Supply (1 A Fuse)
9 NC  not connected
10 NC not connected
11 S2+5V + 5 V Supply (1 A Fuse)
12 S2+5V + 5 V Supply (1 A Fuse)
13 GND Ground
14 RESERVED Reseved for future-purpose
15 GND Ground
16 RESERVED Reseved for future-purpose
17 GND Ground
18 S2TFS Transmit-Frame-Sync (IO)
19 GND Ground
20 S2RFS Receive-Frame-Sync (IO)
21 GND Ground
22 S2TCK Transmit-Clock (IO)
23 GND Ground
24 S2RCK Receive-Clock (IO)
25 GND Ground
26 S2TDX Transmit-Data (OUT)
27 GND Ground
28 S2RDX Receive-Data (IN)
29 GND Ground
30 S2CRDX Configuration-Receive-Data (IN)
31 GND Ground
32 S2RFSDIR Receive-Frame-Sync-Direction (OUT)
33 S2RST ESSI-Reset
34 S2TFSDIR Transmit-Frame-Sync-Direction (OUT)
35 S2RCKDIR Receive-Clock-Direction (OUT)
36 S2TCKDIR Transmit-Clock-Direction (OUT)
37 S2DT/CTL Data/Control-Qualifier (OUT)
38 S2SRB1 Sample-Rate-Bit 1 (OUT)
39 S2SRB0 Sample-Rate-Bit 0 (OUT)
40 S2SRB2 Sample-Rate-Bit 2 (OUT)
41 GND Ground
42 S2CTDX Configuration-Transmit-Data (OUT)
43 GND Ground
44 S2CTEN Configuration-Transmit-Enable (OUT)
45 GND Ground
46 S2CCLK Configuration-Clock (OUT)
47 GND Ground
48 S2CREN Configuration-Receive-Enable (OUT)
49 GND Ground
50 KEY not connected and mechan. Key
(back to Table of Contents)

CON4:

Pin: Signal-Name: Signal-Description:
1 +3V +3.3 V Supply
2 +5V +5 V Supply
3 +3V +3.3 V Supply
4 +5V +5 V Supply
5 GND Ground
6 GND Ground
7 DA12 DSP-Address-Bus-Bit 12 (OUT)
8 /WR Write-Enable (OUT)
9 DA7 DSP-Address-Bus-Bit 7 (OUT)
10 DA14 DSP-Address-Bus-Bit 14 (OUT)
11 DA6 DSP-Address-Bus-Bit 6 (OUT)
12 DA13 DSP-Address-Bus-Bit 13 (OUT)
13 DA5 DSP-Address-Bus-Bit 5 (OUT)
14 DA8 DSP-Address-Bus-Bit 8 (OUT)
15 DA4 DSP-Address-Bus-Bit 4 (OUT)
16 DA9 DSP-Address-Bus-Bit 9 (OUT)
17 DA3 DSP-Address-Bus-Bit 3 (OUT)
18 DA11 DSP-Address-Bus-Bit 11 (OUT)
19 DA2 DSP-Address-Bus-Bit 2 (OUT)
20 /RD Read-Enable (OUT)
21 DA1 DSP-Address-Bus-Bit 1 (OUT)
22 DA10 DSP-Address-Bus-Bit 10 (OUT)
23 DA0 DSP-Address-Bus-Bit 0 (OUT)
24 AA1 Chipselect (OUT)
25 DD6 DSP-Data-Bus-Bit 6 (IO)
26 DD7 DSP-Data-Bus-Bit 7 (IO)
27 DD3 DSP-Data-Bus-Bit 3 (IO)
28 DD5 DSP-Data-Bus-Bit 5 (IO)
29 DD4 DSP-Data-Bus-Bit 4 (IO)
30 DD1 DSP-Data-Bus-Bit 1 (IO)
31 DD0 DSP-Data-Bus-Bit 0 (IO)
32 DD2 DSP-Data-Bus-Bit 2 (IO)
33 DA22 DSP-Address-Bus-Bit 22 (OUT)
34 DA23 DSP-Address-Bus-Bit 23 (OUT)
35 DA20 DSP-Address-Bus-Bit 20 (OUT)
36 DA21 DSP-Address-Bus-Bit 21 (OUT)
37 DA18 DSP-Address-Bus-Bit 18 (OUT)
38 DA19 DSP-Address-Bus-Bit 19 (OUT)
39 DA16 DSP-Address-Bus-Bit 16 (OUT)
40 DA17 DSP-Address-Bus-Bit 17 (OUT)
(back to Table of Contents)

CON6:

Pin: Signal-Name: Signal-Description:
1 AA3 Chipselect (OUT)
2 DA15 DSP-Address-Bus-Bit 15 (OUT)
3 /BG Bus-Grant (IN)
4 /BR Bus-Request (OUT)
5 /BB Bus-Busy (IO)
6 /TA Transfer-Acknowledge (IN)
7 CLKOUT synchr. DSP-Clock (OUT)
8 /CAS Column-Address-Strobe (OUT)
9 AA0 Chipselect (OUT)
10 DD17 DSP-Data-Bus-Bit 17 (IO)
11 /BS Bus-Strobe (OUT)
12 /BL Bus-Lock (OUT)
13 /RESET Board-Reset (OUT)
14 AA2 Chipselect (OUT)
15 KEY not connected and mechan. Key
16 DD9 DSP-Data-Bus-Bit 9 (IO)
17 DD8 DSP-Data-Bus-Bit 8 (IO)
18 DD11 DSP-Data-Bus-Bit 11 (IO)
19 DD10 DSP-Data-Bus-Bit 10 (IO)
20 DD20 DSP-Data-Bus-Bit 20 (IO)
21 DD16 DSP-Data-Bus-Bit 16 (IO)
22 DD21 DSP-Data-Bus-Bit 21 (IO)
23 DD22 DSP-Data-Bus-Bit 22 (IO)
24 DD23 DSP-Data-Bus-Bit 23 (IO)
25 DD12 DSP-Data-Bus-Bit 12 (IO)
26 DD14 DSP-Data-Bus-Bit 14 (IO)
27 DD13 DSP-Data-Bus-Bit 13 (IO)
28 DD18 DSP-Data-Bus-Bit 18 (IO)
29 DD15 DSP-Data-Bus-Bit 15 (IO)
30 DD19 DSP-Data-Bus-Bit 19 (IO)
31 EX/IRQB Extern. Interrupt-Reqest B (IN)
32 EX/IRQA Extern. Interrupt-Reqest A (IN)
33 EX/NMI Nonmask. Interrupt (IN)
34 EX/IRQC Extern. Interrupt-Reqest C (IN)
35 GND Ground
36 GND Ground
37 +3V +3.3 V Supply
38 +5V +5 V Supply
39 +3V +3.3 V Supply
40 +5V +5 V Supply
(back to Table of Contents)
 
Pin: Signal-Name: Signal-Description:
1 +MIDI_IN Midi-In (Current In)
2 -MIDI_IN Midi-In (Current Out)
3 +MIDI_OUT Midi-Out (Current Out)
4 -MIDI_OUT Midi-Out (Current In)
5 GND Ground
6 +MIDI_THR Midi-Through (Current Out)
7 -MIDI_THR Midi-Through (Current In)
8 GND Ground
9 NC not connected
(back to Table of Contents)
 
Pin: Signal-Name: Signal-Description:
1 NC not connected
2 +RDX Receive Data from Interface to DSP (IN)
3 +TDX Transmit Data from DSP to Interface (OUT)
4 NC not connected
5 GND Ground
6 NC not connected
7 NC not connected
8 GND Ground
9 NC not connected
(back to Table of Contents)
 
Pin: Signal-Name: Signal-Description:
1 TDI Test-Data-Input (IN)
2 GND Ground
3 TDO Test-Data-Output (OUT)
4 GND Ground
5 TCK Test-Clock (IN)
6 GND Ground
7 NC not connected
8 KEY not connected and mechan. Key
9 /RESET DSP-Reset (OUT)
10 TMS Test-Mode-Select (IN)
11 +3V +3.3 V Supply
12 NC not connected
13 /DE Debug-Event (IO)
14 /TRST Test-Reset (IN)
(back to Table of Contents)
Provided that the DSP is already mounted on the MAAB-PCB,
check the resistance of the following signals with an ohmmeter: Afterwards, make sure that the IC1-joints are well soldered and that there are no solder-bridges.
Make sure that the higher potential of the ohmmeter is connected to the higher potential in the circuit and vice versa.
The order of potentials in the circuit is: The supply of the ICs is: Two pictures of the PCB before mounting: (back to Table of Contents)
If all previous measurements were correct, you should mount and solder the following components: (back to Table of Contents)
IC19 was changed: a MAX811CUS-T was used instead of an MC34164. Therefore, you have to patch the circuit around IC19. First you should mount and solder the MAX811CUS-T with its Pins 3 and 4 on the unused Pads 5 ... 8 of IC19. Then you should bridge R15 and patch the following connections with a thin wire: C5, R14, R15 and D2 will not be mounted, R15 has been replaced by a wire-bridge.

(back to Table of Contents)

Now you should check several connections on the board: Afterwards, check the IC19-Patch to make sure that the joints are well soldered and that there are no solder-bridges.
The same measuring-rules as in Pre-Checking the PCB are valid.

(back to Table of Contents)

The MAAB  should first be tested stand-alone. You have to solder 2 insolated wires (red and black) to IC20 Pin 1 (Ground = black) and to IC20 Pin 3 (+5V = red). Insert only Jumpers A, C and P (SCI-Bootstrap).

You should own a Voltage-regulated Power-Supply with variable Current-Control.

Adjust the voltage to 5V, the current-control to minimum (about 1 mA) and connect the 2 supply-wires of the PCB to the supply correctly. Then slowly increase the current-control up to 200 mA while you measure the voltage between +3V and Ground (IC20 Pin 2 and 1). The voltage should have 3.3 V , the current of the board should be less than 150 mA. LED1 should give a green light. After pushing SW1, IC15 Pin 1 should be LOW for a short time (min. 140 ms) and afterwards HIGH (5V).

If you have an Oscilloscope, you can check 2 Clock-Signals; at CON6 Pin 7 you should measure a 17 MHz / 3.3 V peak to peak signal; at IC16 Pin 5 (Pin 8 respectivly) you should measure a 16 MHz / 5 V peak to peak signal.

(back to Table of Contents)

If the previous measurements were correct, you can continue to mount components on the PCB. (back to Table of Contents)
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Now you should check several connections on board again: Afterwards, check all newly soldered components, to make sure that they have well-soldered joints and no solder-bridges.
The same measuring rules as in Pre-Checking the PCB are valid.

(back to Table of Contents)

The MAAB should be tested stand-alone again. Follow the same procedure as in
Testing the PCB by External Supply (Part 1) . Only the supply-current will increase to 200 mA.

(back to Table of Contents)

description is in progress. ...
(back to Table of Contents)